USA Computer Tech R&D
Advanced Thermal Management for High-Density AI Infrastructure
We are fundamentally solving the “Thermal Wall” through modular, proprietary patent pending modular thermal control architectures. Founder-led research focused on expanding thermal headroom and ensuring infrastructure sovereignty in the age of 1,000W+ TDP.
Non-confidential by default. Standards-aware testing. Deeper technical exchange available under mutual NDA.
AI Data Center Cooling Constraints
Next-generation AI accelerators (NVIDIA Blackwell/Rubin) and high-bin server CPUs have pushed thermal management from a facilities concern into a core system constraint. Rack power densities are exceeding 100 kW+, creating localized heat flux that traditional air and standard liquid cooling cannot dissipate efficiently.
Our R&D initiative addresses these constraints through practical thermal control strategies that scale from prototype rigs to data-center-relevant environments. We target the specific bottlenecks that force thermal throttling and reduce ROI on expensive AI silicon.
2026 Market Context
- Energy Consumption: 1.5% Global Share (IEA)
- Load Growth: Projected 3x by 2028 (DOE)
- Density Crisis: 30 kW – 140 kW per Rack
- Efficiency Target: 1.05 PUE Roadmap
Redefining Thermal Headroom
Sub-ambient performance is not just “colder coolant”—it is an integrated control problem.
Modular Lift
We explore approaches that aim to deliver controlled thermal margin below ambient conditions using proprietary distributed solid-state thermal control methods.
Operational Guardrails
Non-condensing behavior through humidity-aware controls and proprietary atmospheric isolation strategies (The Jerusalem Solution).
Transient Stability
Maintaining mathematical Coefficient of Performance (COP) superiority under sustained multi-core loads and thermal spikes.
Experimental Validation Methodology
We prioritize testable claims, repeatability, and standards-aware reporting.
Validation Metrics
Our results are validated against metrics that matter to data center operators and semiconductor thermal architects:
| Benchmark Parameter | Observed TRL 5 Baseline |
|---|---|
| All-Core Clock Frequency (High-TDP) | 4.1 GHz Sustained Stability |
| Thermal Lift Capacity (ΔT) | 60°C Stable Delta |
| Cooling Power Requirement | Efficiency gains demonstrated vs baseline cooling methods |
| PUE Optimization Potential | Target 1.05 at Facility Level |
Testing Philosophy
- Bench-to-System Scaling: Component-level de-risking followed by full-scale system mockups.
- Calibrated Instrumentation: Multi-point temperature measurement with quantified uncertainty profiles (NIST Note 1297).
- Standards Awareness: Reporting aligned with JEDEC JESD51 and OCP best practices.
- Reproducibility: Detailed run sheets and documentation for cross-border engineering validation.
International R&D Expansion & Collaboration
Thermal management challenges are global, and so is the talent required to solve them. We are currently establishing our permanent Research and Development headquarters in Jerusalem, Israel. This move aligns the initiative with Israel’s semiconductor ecosystem, national innovation programs, and strategic AI infrastructure development.
Partner Workflows
Joint experiments on specific thermal constraints, pilot integration for server blades, and university lab collaborations.
Infrastructure Synergy
Optimizing sub-ambient cooling for “Green IT” mandates and dual-use high-density compute, and strategic infrastructure applications
Start a Technical Intake Discussion
If you are building or operating high-density compute and require validated thermal headroom—let’s talk.
Justin Breithaupt | Hardware Founder | PO Box 485, Pomeroy, WA 99347
Jerusalem R&D Site (Proposed) |
Email:
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Israel: +972 55-727-0963 | USA: +1 509-843-7256